The DPC (direct plate copper) process is able to promise ultimate precision in products, with its primary technique involving magnetron sputtering to plate copper onto the substrate. This is followed by surface treatment to improve the substrate’s solderability and anti-oxidation properties, enabling the creation of fine lines, better flatness, and stronger adhesion.
The first step is to clean the ceramic surface to remove stains and foreign objects from the ceramic surface.
It’s to deposit a thin copper metal film onto the substrate, preparing it for the subsequent pattern transfer process.
After electroplating, it’s important to ensure that the copper surface is clean and roughened to improve adhesion for the next processes.
It involves the use of ultraviolet light to transfer the pattern from the film to the copper surface. After exposure, using chemicals to dissolve and wash off the unexposed film.
Based on customer needs, various surface treatments are available, including anti-oxidation, nickel-gold plating, nickel-palladium-gold plating, nickel-gold plating, and silver plating.
The last step is that the final products, after cleaning and cutting, are inspected for appearance, and qualified products are packaged for shipment.
